Many modern opamps are only available in SMD devices. This makes prototyping difficult as these chips do not fit on a standard 100-mil protoboard. This board will allow you to integrate through-hole components such as resistors, capacitors etc with several SOIC SMD components.
The board includes pads only. There are no connections between any pads. As with standard 100mil protoboards, the user is invited to add wiring by soldering thin wires between pads.
We have chosen SOIC since this makes many modern opamps possible, and it is still large enough to allow manual soldering.
The board supports extra-long pads. These will support the standard 150-mil wide circuits, but also the wider 300-mil circuits.
An extra pair of power lines is provided underneath the SMD chips. These are present on both copper layers (top and bottom) and are interconnected top-to-bottom with via's. This makes it easy to wire power to the chips as needed.
| Board dimension | 50 x 80 mm |
| Board material | FR4 |
| Board finish | HASL |
| Thickness | 1.6 mm |
| SMD pads | 2 rows of 63 pads |
| SMD pad pitch | 1.27 mm (50 mil) |
| SMD pad type | double-sided. Reachable from bottom layer Interconnected top-to-bottom. |
| Full solder mask | Both sides |
| Matching package |
|
| TH pads | 2 x 7 rows of 31 pads |
| TH pads | dual-sided metallised. |
| TH pad pitch | 2.54 mm (100 mil). |
| Matching package |
|
0.8 mm.
| |
